Circuit Feature | Production(um) | Advanced(um) | Future(um) |
Through Via Size (Drill Diameter) | 200 | 200 | 200 |
Pad over drill size-inner layer | 125 | 100 | 100 |
Pad over drill size-outer layer | 125 | 100 | 100 |
Maximum Aspect Ratio | 8:1 | 10:1 | 12:1 |
Plated via Diameter Tolerance | +/-76 | +/-50 | +/-50 |
Solder mask Registration Tolerance | +/-76 | +/-50 | +/-25 |
Layer to layer Registration Tolerance | +/-100 | +/-76 | +/-76 |
| Layer count maximum | 8 | 10~12 | 14~16 |
Panel size maximum (in mm) | 550X650 | 550X650 | 550X650 |
Inner layer L/S minimum (0.5oz copper) | 100/100 | 76/76 | 76/76 |
Inner layer L/S Tolerance (0.5oz copper) | +/-20 | +/-15 | +/-15 |
Inner layer L/S minimum (1.0oz copper) | 125 | 100 | 76/100 |
Inner layer L/S Tolerance (1.0oz copper) | +/-25 | +/-20 | +/-15 |
Outer layer L/S minimum (0.5oz copper) | 100/100 | 80/80 | 76/76 |
Outer layer L/S Tolerance (0.5oz copper) | +/-25 | +/-20 | +/-15 |
Outer layer L/S minimum (1.0oz copper) | 125/125 | 100/100 | 76/76 |
Outer layer L/S Tolerance (1.0oz copper) | +/-25 | +/-20 | +/-20 |
Routed feature Tolerance (profile tolerance) | +/-125 | +/-100 | +/-50 |
Board thickness minimum (in mm) | 0.3 | 0.2 | 0.15 |
Board thickness maximum (in mm) | 2.5 | 3.2 | 4.0 |
Impedance control | +/-10% | +/-8% | +/-8% |
Laminate Materials |
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FR4;Tg135,Tg150,Tg170 | Yes | Yes | Yes |
Cem-3 | Yes | Yes | Yes |
Ceramic | Yes | Yes | Yes |
Aluminum Substrate | Yes | Yes | Yes |
Rogers R4233，R4003 | Yes | Yes | Yes |
IS410，IS680 | Yes | Yes | Yes |
Blind and buried hole |
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Minimum blind hole | 0.2 | / | / |
Blind hole layer/level | 2 | 3 | 4 |
Mininum buried hole | 0.2 | / | / |
Buried hole layer/level | 1 | / | / |
Via-plugged (by epoxy) | 0.2-1.2 | / | / |
Via-plugged (by solder resist ink) | 0.2-0.6 | / | / |
Minimum drill hole size (Mechanical drilling) | 0.2 | / | / |
Laser drilling (not in production currently. Outsourcing is available if necessary) | / | / | / |
